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Thin Film Interconnects (TFI) Advances Stateside Chip Manufacturing Through Frederick Innovative Technology Center, Inc. (FITCI) Soft Landing Program

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TFI will launch its inaugural U.S. operation with a patented, next-generation production process that surpasses current alternatives in speed and reduced environmental impact. FREDERICK, Md., April 17, 2024 /PRNewswire-PRWeb/ -- Thin Film Interconnects (TFI), a pioneering technology...


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